Method and apparatus for repairing an electrostatic chuck device, and the electrostatic chuck device

ABSTRACT

In a repairing method for an electrostatic chuck device in which at least an adhesive layer and an attracting layer are provided on a metal base, a side surface of an eroded adhesive layer is wound with a string-like adhesive and thermal compression is performed thereafter. A repairing apparatus for an electrostatic chuck device, which is used in the repairing method, includes a rotatable table for rotating the electrostatic chuck device and a bobbin for supplying the adhesive to the adhesive layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to Japanese Patent Application No.2009-005611 filed on Jan. 14, 2009, the entire contents of which areincorporated herein by reference.

FIELD OF THE INVENTION

The present invention relates to a method and an apparatus for repairingan electrostatic chuck device, and the electrostatic chuck device.

BACKGROUND OF THE INVENTION

In an industrial field for manufacturing an IC chip or the like, a chuckdevice for holding a semiconductor wafer in a predetermined portion of aprocessing device is widely used in a semiconductor wafer process. Thechuck device may be a mechanical chuck device, a vacuum chuck device oran electrostatic chuck device. The electrostatic chuck device isadvantageous especially to reliably attract and fix an unevensemiconductor wafer, and also, the electrostatic chuck device is easy tohandle and use even in a vacuum state.

The electrostatic chuck device attracts an object to be attracted suchas a wafer or the like by static electricity generated by applying avoltage to an internal electrode embedded in an insulating member.Further, the wafer is processed by, e.g., plasma etching in a statewhere temperature of the wafer is controlled to be maintained at adesired level by heating an attracting surface (chuck surface) by aheater built in the chuck. A ceramic plate is widely used for anattracting layer forming the wafer attracting surface because of itshigh resistance to the plasma etching and long life span.

As for the electrostatic chuck device, there is widely used one having astructure in which a metal base and a ceramic plate are adhered to eachother by an adhesive. However, in this electrostatic chuck device, anexposed side surface of an adhesive layer between the metal base and theceramic plate is eroded by the side etching of the plasma during theprocessing of the wafer. If an outer peripheral portion of the adhesivelayer is eroded, thermal conductivity between the ceramic plate and themetal base at the outer peripheral of the ceramic plate becomesdifferent from that at the central portion of the ceramic plate.Therefore, it is difficult to uniformly dissipate heat of the wafer,which is brought to a high temperature by the etching, through the metalbase via the ceramic plate and the adhesive layer. This leads to atemperature deviation on the wafer, and desired etching cannot beperformed due to the bending of the wafer.

As for the electrostatic chuck device for suppressing erosion of theside surface of the adhesive layer, there is proposed an electrostaticchuck device in which an erosion preventing insulating material isprovided at the side surface of the adhesive layer (Japanese PatentApplication Publication NO. 2000-114358).

However, the electrostatic chuck device disclosed in Japanese PatentApplication Publication NO. 2000-114358 may not sufficiently suppressthe erosion of the adhesive layer by the plasma.

When the adhesive layer is eroded, it may be necessary to repair theadhesive layer by applying a liquid adhesive dissolved in a solvent tothe eroded portion and performing thermal compression. In this method,however, voids are generated in the repaired portion of the adhesivelayer due to evaporation of the solvent. Since the adhesive layerbecomes non-uniform, the thermal conductivity of the repaired adhesivelayer becomes non-uniform. Accordingly, when the adhesive layer iseroded, the adhesive layer and the ceramic plate are discarded andreplaced even if the ceramic plate is still usable.

As described above, when the adhesive layer deteriorates, the ceramicplate has to be replaced regardless of its good durability and long lifespan and, hence, the characteristics of the ceramic plate cannot besufficiently utilized. Therefore, it is required to reduce a maintenancecost by preventing replacement of the high-priced ceramic plate whilemaintaining performance of the electrostatic chuck device by uniformlyrepairing the eroded side surface of the adhesive layer.

SUMMARY OF THE INVENTION

In view of the above, the present invention provides a repairing methodand apparatus capable of uniformly repairing an eroded side surface ofan adhesive layer in an electrostatic chuck device, and an electrostaticchuck device to which the repairing method and the repairing apparatusare applied.

In accordance with an aspect of the present invention, there is provideda repairing method for an electrostatic chuck device in which at leastan adhesive layer and an attracting layer are provided on a metal base,wherein a side surface of an eroded adhesive layer is wound with astring-like adhesive and thermal compression is performed thereafter.

Further, the string-like adhesive may be made of a material same as amaterial of the adhesive layer.

Further, the adhesive layer and the string-like adhesive may containacrylic rubber and thermosetting resin.

Further, the string-like adhesive may have a rectangular cross section.

Further, a height of the string-like adhesive may be about 1 to 2 timesgreater than a height of the adhesive layer.

Further, the thermal compression may be performed under the condition ofabout 0.02 to 0.5 MPa.

In accordance with another aspect of the present invention, there isprovided a repairing apparatus for an electrostatic chuck device whichis used in the repairing method described above, including a rotatabletable for rotating the electrostatic chuck device and a bobbin forsupplying the adhesive to the adhesive layer.

The repairing apparatus for an electrostatic chuck device describedabove further includes a positioning device for positioning the adhesivebetween the bobbin and the adhesive layer.

In accordance with still another aspect of the present invention, thereis provided an electrostatic chuck device in which at least an adhesivelayer and an attracting layer are provided on a metal base, wherein aside surface of the adhesive layer is wound with a string-like adhesive.

In accordance with the repairing method of the present invention, evenif the side surface of the adhesive layer of the electrostatic chuckdevice is eroded, the eroded portion can be uniformly repaired. Further,in accordance with the repairing apparatus of the present invention,when the side surface of the adhesive layer of the electrostatic chuckdevice is eroded, the eroded portion can be easily and uniformlyrepaired. Furthermore, the present invention can provide anelectrostatic chuck device to which the repairing method and therepairing apparatus are applied.

BRIEF DESCRIPTION OF THE DRAWINGS

The objects and features of the present invention will become apparentfrom the following description of embodiments, given in conjunction withthe accompanying drawings, in which:

FIG. 1 is a top view schematically showing an example of a repairingapparatus in accordance with an embodiment of the present invention;

FIG. 2 describes a front view of a rotatable table and an electrostaticchuck device shown in FIG. 1;

FIG. 3 provides a perspective view of the rotatable table and theelectrostatic chuck device shown FIG. 1;

FIG. 4 shows a cross sectional view illustrating an example of theelectrostatic chuck device in accordance with the embodiment of thepresent invention;

FIG. 5 represents a cross sectional view of an adhesive layer having athree-layer structure of the electrostatic chuck device; and

FIG. 6 offers a schematic top view depicting a state in which theadhesive layer is wound with a string-like adhesive.

DETAILED DESCRIPTION OF EMBODIMENT

Hereinafter, an embodiment of the present invention will be describedwith reference to the accompanying drawings which form a part hereof.

[Repairing Apparatus]

A repairing apparatus for an electrostatic chuck device in accordancewith the present invention is used to repair an eroded side surface ofan adhesive layer of the electrostatic chuck device. There is noparticular limitation on the electrostatic chuck device to which therepairing apparatus in accordance with the present invention is appliedas long as it has a structure in which at least an adhesive layer and anattracting layer are provided on a metal base.

Hereinafter, an example of the repairing apparatus in accordance with anembodiment of the present invention will be described in detail. FIG. 1is a top view showing a state where an electrostatic chuck device 20(shown in FIG. 4) is repaired by using a repairing apparatus 10 of thepresent embodiment; and FIG. 2 is a front view of the electrostaticchuck device 20.

As shown in FIG. 4, the electrostatic chuck device 20 has a well-knownstructure in which a metal base 21 and an attracting layer 23 made ofceramic or insulating resin sheet having therein an electrode areadhered to each other by an adhesive layer 22. A wafer 24 is attractedto and held on a top surface of the attracting layer 23.

As illustrated in FIG. 1, the repairing apparatus 10 of the presentembodiment includes a rotatable table 11 for rotating the electrostaticchuck device 20; a bobbin 12 for supplying an elastic string-likeadhesive 14 (hereinafter, simply referred to as an “adhesive 14”) to theadhesive layer 22 of the electrostatic chuck device 20; and apositioning device 13 for positioning the adhesive 14 between the bobbin12 and the adhesive layer 22.

There is no particular limitation on the shape or the size of therotatable table 11 as long as it can mount thereon the electrostaticchuck device 20 and stably rotate the electrostatic chuck device 20 at adesired speed. The rotatable table 11 in this example is larger than themetal base 21 of the electrostatic chuck device 20 and has a disc shape,as shown in FIGS. 2 and 3. By rotating the rotatable table 11, theelectrostatic chuck device 20 mounted thereon can be rotated at adesired speed.

The rotatable table 11 may be rotated manually by using a handle or thelike or by using a control unit for controlling start and stop ofrotation, rotational speed and the like.

The bobbin 12 supplies the adhesive 14 to an eroded side surface 22 a(shown in FIG. 3) of the adhesive layer 22. The adhesive 14 is woundaround the bobbin 12. There is no particular limitation on the bobbin 12as long as a string-like material can be wound thereto and it can be aconventional bobbin that uses a string-like material wound thereto.

The adhesive 14 has a string shape and is preferably made of a materialsame as that of an adhesive forming the adhesive layer 22 to berepaired. The adhesive layer 22 is repaired by the adhesive 14 made of amaterial same as that of the adhesive forming the adhesive layer 22 tobe repaired, and thus, the uniform adhesive layer 22 can be easilyobtained. Further, it is possible to prevent a temperature deviation onthe wafer or bending of the attracting layer 23 which is caused by anon-uniform thermal conductivity of the adhesive layer 22.

The adhesive 14 and the adhesive used for the adhesive layer 22 arepreferably made of a material same as that used for the adhesive layerof the electrostatic chuck device. It is further preferable that thismaterial contains acrylic rubber and thermosetting resin. The adhesivecontaining acrylic rubber and thermosetting resin is effective inreducing erosion by a plasma.

The acrylic rubber is a polymer of alkyl (meth)acrylate ester or acopolymer obtained by copolymerizing alkyl (meth)acrylate ester as amain component and a second component having an active group. Amongthem, alkyl (meth)acrylate ester includes ethyl (meth)acrylate, propyl(meth)acrylate, butyl (meth)acrylate, methoxyethyl (meth)acrylate,ethoxyethyl (meth)acrylate or the like. These may be used alone, or atleast two of these may be used in combination.

In addition, examples of the second component having an active groupinclude, e.g., dicyclopentadiene, ethylidenenorbornene, vinylchloroacetate, allyl chloroacetate, 2-chloroethyl vinyl ether, vinylacrylate, allyl methacrylate, glycidyl methacrylate, dimethyl styrylvinylsilane, dicyclopentenyl acrylate, dicyclopentenyl oxyethylacrylate, alkyl glycidyl ether, vinyl glycidyl ether, 2-chloroethylacrylate, vinyl monochloroacetate, vinyl norbornene, acrylic acid,methacrylic acid, itaconic acid or the like. These may be used alone, orat least two of these may be used in combination. The amount of thesecond component having the active group is preferably smaller than orequal to about 15 weight % and more preferably smaller than or equal toabout 10 weight % based on the weight of alkyl (meth)acrylate ester.

Furthermore, the acrylic rubber may contain as a third component amonomer such as acrylonitrile, styrene, 1,3-butadiene, isoprene,chloroprene, ethylene, propylene, vinyl acetate or the like. These maybe used alone, or at least two of these may be used in combination. Thecontent of the third element in the adhesive is preferably less than orequal to about 40 weight %.

A copolymerization method of acrylic rubber of the present invention isnot particularly limited, and a conventional method can be used.However, in order to perform polymerization of a weight averagemolecular weight greater than or equal to about 1 million, a solutionpolymerization method is not suitable, and a method using an emulsifyingsuch as an emulsion polymerization method, a pearl polymerization methodor the like is generally used. The acrylic rubber may be used in apowder state or dissolved in an organic solvent. A commercial acrylicrubber includes Nipol Rubber manufactured by ZEON Co., Ltd., TeisanRubber produced by Nagase ChemteX Co., Ltd., Toa Acron manufactured byTohpe Co. Ltd., Akron Rubber produced by TOAGOSEI Co., Ltd or the like.

There is no particular limitation on the thermosetting resin. However,epoxy resin or phenol resin is preferably used.

Examples of the epoxy resin include, e.g., difunctional orpolyfunctional epoxy resin such as bisphenol type, phenol novolac type,cresol novolac type, glycidyl ether type, glycidyl ester type, glycidylamine type, trihydroxyphenylmethane type, tetraglycidylphenolalkanetype, naphthalene type, diglycidylphenylmethane type, diglycidylbiphenyl type or the like. Among them, bisphenol type epoxy resin ispreferably used, and bisphenol A-type epoxy resin is more preferablyused.

Further, examples of the phenol resin include novolak phenol resins suchas alkylphenol resin, p-phenylphenol resin, bisphenol A type phenolresin or the like, and other known phenol resins such as resol phenolresin, polyphenyl-p-phenol resin or the like. Especially, novolak phenolresin is used preferably.

As for the thermosetting resin, these may be used alone, or at least twoof these may be used in combination.

The content of the acrylic rubber and that of the thermosetting resin inthe adhesive 14 are preferably same as those in the adhesive layer 22.

Besides, the adhesive layer 22 may contain an oxidation inhibitor, afiller and the like depending on purposes. The adhesive 14 contains thesame. In the case of using the epoxy resin, the adhesive layer 22 maycontain a hardening accelerator and a hardening agent for epoxy resin,if necessary. The adhesive 14 contains the same as well. For example,imidazoles, tertiary amines, phenols, dicyandiamides, aromatic diamines,organic peroxides or the like can be used.

The string-like adhesive 14 can be obtained by evenly coating on asurface of a release film an adhesive made of a material same as that ofthe adhesive forming the adhesive layer 22, semi-hardening the adhesivecoated on the release film by heating, and then cutting the adhesivetogether with the release film in a stripe-shape or a spiral-shape.

In addition, in order to reduce stress and suppress plasma erosion, theadhesive layer 22 is preferably made to have a three-layer structure inwhich a first and a second adhesive layer 22 b and 22 d are formed onboth sides of a stress relief layer 22 c as shown in FIG. 5. In thatcase, it is further preferable to use the adhesive 14 having athree-layer structure in repairing, each layer being made of a materialsame as that of each layer of the adhesive layer 22.

The stress relief layer 22 c is not particularly limited as long as itis a rubber-like elastic member containing acrylic rubber, and thematerial thereof can be properly selected depending on purposes. Theacrylic rubber can be made of a material same as that of theabove-described adhesive. The stress relief layer 22 c may containrubber other than silicon rubber in addition to the acrylic rubber. Forexample, butyl rubber, nitrile rubber, chloroprene rubber, urethanerubber, natural rubber or the like can be used.

Each of the first and the second adhesive layer 22 b and 22 d may bemade of a material same as that of the above-described adhesive.

If the adhesive layer 22 has such a three-layer structure and theadhesive 14 having the same structure and component as those of theadhesive layer 22 is used, the adhesive 14 can be obtained by thefollowing method, for example. A sheet as the first adhesive layer 22 bis obtained by coating the first adhesive layer 22 b on a release filmand heating the coated first adhesive layer. In the same manner, sheetsas the stress relief layer 22 c and the second adhesive layer 22 d areformed on respective release films. A three-layer structure sheet isobtained by sequentially laminating the sheet as the first adhesivelayer 22 b, the sheet as the stress relief layer 22 c and the sheet asthe second adhesive layer 22 d after the respective release films of thestress relief layer 22 c and the second adhesive layer 22 d are removed.Thereafter, the three-layer structure sheet is cut together with therelease film of the first adhesive layer 22 b in a stripe-shape or aspiral-shape.

If the adhesive layer 22 has the above-described laminated structure, itis extremely difficult to obtain, by spinning, the string-like adhesive14 having a completely same structure and component as those of theadhesive layer 22. Therefore, the adhesive 14 can preferably be obtainedby using the three-layer structure sheet formed by semi-hardening anadhesive on a release film as described above. Accordingly, the adhesive14 having the completely same structure and component as those of theadhesive layer 22 can be easily obtained.

A leading end 14 a (FIG. 3) of the adhesive 14 can be adhered to theside surface 22 a of the adhesive layer 22 by pressurizing the leadingend 14 a to the side surface 22 by using a jig or the like due to theadhesivity of the adhesive 14.

The cross sectional shape of the adhesive 14 is not particularlylimited, but is preferably a rectangle. When the cross sectional shapeis a rectangle, the eroded adhesive layer can be filled with theadhesive 14 without a gap.

A thickness “a” of the adhesive 14 (a length of the adhesive 14 in aradial direction of the adhesive layer 22 wound by the adhesive 14 shownin FIG. 6) is preferably smaller than or equal to about 1/10 of a lengthof an eroded portion of the adhesive layer 22 (a thickness that can befilled by winding the adhesive 14 at least ten times). By setting aratio of a/b to be smaller than or equal to about 1/10, a gap is hardlygenerated when the adhesive layer 22 is wound with the adhesive 14. Inother words, when the thickness “a” of the adhesive 14 is greater than1/10 of the length “b”, a gap α is easily generated at the leading end14 a of the adhesive 14 when second winding of the adhesive 14 on theadhesive layer 22 is conducted (shown in FIG. 6). As the thickness “a”of the adhesive 14 decreases, the adhesive 14 can be wound securelywithout generating the gap α.

A height “c” of the adhesive 14 (a length in a height direction (Z-axisdirection) of the adhesive layer 22 shown in FIG. 3) is preferably thesame or slightly greater than a height “d” of the adhesive layer 22(shown in FIG. 3). More preferably, it is about 1 to 2 times greater,and further preferably about 1.05 to 1.15 times greater than the height“d”. When the height “c” is about same or slightly greater than theheight “d”, the adhesive 14 need not be wound multiple times in a heightdirection of the adhesive layer 22 and, also, a generation of a gap canbe prevented at a portion repaired by the adhesive 14 in the heightdirection of the adhesive layer 22. Hence, the uniform adhesive layer 22can be easily obtained by repairing the eroded adhesive layer 22.Further, when the adhesive 14 is used while being tightened by thepositioning device 13 in the repairing apparatus 10, the adhesive 14 isstretched and becomes thin. In that case, the repairing operation isperformed by using a slightly thicker adhesive 14 as described above.

The height “d” of the adhesive layer 22 is generally about 100 μm, sothat the height “c” of the adhesive 14 is preferably about 100 μm orslightly greater than about 100 μm (e.g., about 110 μm).

As will be described later, the repairing operation in the presentinvention is preferably performed when the adhesive layer 22 is erodedinward by about 1 to 10 mm from a circumference (an initial position ofthe side surface of the adhesive layer 22) of the attracting layer 23.The eroded side surface 22 a of the adhesive layer 22 is wound at leastten times by the adhesive 14 having the thickness “a” that is about 1/10of the eroded length “b” so that the eroded adhesive layer 22 can becompletely repaired to be even with the circumference of the attractinglayer 23.

For example, when the string-like adhesive 14 having a thickness “a” of,e.g., about 5 mm, is used to repair the adhesive layer 22 which iseroded inward from the circumference of the attracting layer 23 by about6 mm (the length “b” being about 6 mm), a portion of the adhesive layer22 positioned about 1 mm inward from the circumference of the attractinglayer 23 is not repaired. However, in the case of using a string-likeadhesive that is sufficiently thin compared to the eroded length “b”(small thickness “a”), the adhesive layer 22 can be uniformly repairedby multiply winding the string-like adhesive 14 to make the repairedadhesive layer 22 be even with the circumference of the attracting layer23 without leaving an unrepaired portion.

The positioning device 13 performs positioning of the adhesive 14between the bobbin 12 and the adhesive layer 22. In other words, thepositioning device 13 can make position of the adhesive 14 coincide withthe position of the adhesive layer 22 in the height direction (Z-axisdirection), and also can tighten or relax the adhesive 14 as required.

For example, the position of the adhesive 14 in the Z-axis direction canbe adjusted to coincide with the position of the adhesive layer 22 bymaking the adhesive 14 passing through the positioning device 13 andmoving the positioning device 13 in the Z-axis direction. Moreover, theadhesive can be tightened or relaxed by moving the positioning device 13in an X-axis direction, (shown FIG. 1). That is, the side surface 22 aof the adhesive layer 22 can be firmly wound by properly tightening theadhesive 14.

[Repairing Method]

A repairing method for an electrostatic chuck of the present inventionis used for an electrostatic chuck in which at least an adhesive layerand an attracting layer are provided on a metal base. The repairingmethod of the present invention is characterized in that the repairingoperation is performed by winding a string-like adhesive around aneroded side surface of the adhesive layer and performing thermalcompression.

Hereinafter, a method for repairing the adhesive layer 22 of theelectrostatic chuck device 20 by using the above-described repairingapparatus 10 will be described as an example of the repairing method inaccordance with an embodiment of the present invention.

The adhesive layer 22 of the electrostatic chuck device 20 has anexposed side surface to thereby be eroded by the plasma or the like(shown FIG. 2).

The repairing method of the present embodiment is performed when theexposed side surface of the adhesive layer 22 of the electrostatic chuckdevice 20 is eroded inward by about 1 to 10 mm from the circumference ofthe attracting layer 23 (when the length “b” is about 1 to 10 mm), andpreferably when the eroded length “b” is smaller than about 5 mm inorder to prevent generation of defects on the wafer by the erosion. Ifthe eroded length “b” of the adhesive layer 22 is greater than about 10mm, the thermal conductivity of the outermost peripheral portion of thewafer 24 (a portion corresponding to the eroded portion of the adhesivelayer 22) deteriorates considerably. Hence, the etching state at thecentral portion of the wafer becomes different from that at theoutermost peripheral portion thereof, and defects are easily generatedon the wafer.

By performing the repairing operation especially when the eroded length“b” is smaller than about 5 mm, the generation of defects on the waferby the erosion of the adhesive layer 22 can be prevented, and also itbecomes easy to maintain the performance of the electrostatic chuck 20.Further, in the case where the electrostatic chuck device 20 has thereina unit for supplying cooling gas such as He or the like for cooling thewafer 24, a cooling gas outlet can also be easily prevented from beingexposed.

In the repairing method of the present invention, first, the adhesive 14supplied from the bobbin 12 is made to pass through the positioningdevice 13, and the leading end 14 a of the adhesive 14 is made to adhereto the eroded side surface 22 a of the adhesive layer 22 (shown in FIG.3). Due to the adhesivity of the adhesive 14, the leading end 14 a ofthe adhesive 14 can be made to adhere to the side surface 22 a bypressurizing the adhesive 14 by inserting a jig between the metal base21 and the attracting layer 23.

It is preferred that the adhesive 14 has the cross sectional shape, thethickness “a” and the height “c” same as those described above.

Moreover, in order to wind the adhesive 14 around the eroded portion ofthe adhesive layer 22, the position of the positioning device 13 isadjusted in advance, and the adhesive 14 is properly tightened. Withsuch tightened adhesive 14, the eroded portion can be firmly wound and,further, the uniform adhesive layer 22 can be easily obtained after therepairing operation.

After sufficient adhesive 14 is wound around the side surface 22 a ofthe adhesive layer 22 to thereby make the repaired adhesive layer 22 beeven with the circumference of the attracting layer 23, the woundadhesive 14 and the adhesive layer 22 are thermally compressed to makethem fuse into one. The conditions of the thermal compression are thesame as those applied when the adhesive layer of the electrostatic chuckdevice is manufactured. Specifically, it is preferably performed underthe condition of about 0.02 to 0.5 MPa.

By using the above-described method, the electrostatic chuck device 20having an eroded adhesive layer 22 can be repaired.

[Electrostatic Chuck Device]

In the electrostatic chuck device to which the above-described repairingapparatus or repairing method is applied, a side surface of the adhesivelayer is wound with a string-like adhesive. Since the electrostaticchuck device has a uniform adhesive layer, the heat of the wafer can beuniformly radiated from the metal base via the adhesive layer.Accordingly, desired etching process can be performed on the wafer.

In accordance with the aforementioned method and apparatus for repairingthe electrostatic chuck device, the eroded adhesive layer can beuniformly repaired. Therefore, the thermal conductivity of the repairedadhesive layer is uniform even after the repairing operation, anddefects are not generated on the wafer. This ensures a long life span ofthe electrostatic chuck device.

The method for repairing an electrostatic chuck of the present inventionis not limited to a method using the repairing apparatus 10 shown inFIG. 1. Further, the repairing apparatus may not have the positioningdevice 13. Although FIGS. 1 to 3 describe the repairing operation of theelectrostatic chuck device 20, the object to be repaired is not limitedthereto, and may be various electrostatic chuck devices, as long as eachof which has an eroded adhesive layer.

The method for repairing an electrostatic chuck device of the presentinvention is very effective in uniformly repairing an eroded adhesivelayer. Therefore, the adhesive layer and the attracting layer can berepaired without being replaced unlike in a prior art.

While the invention has been shown and described with respect to theembodiments, it will be understood by those skilled in the art thatvarious changes and modification may be made without departing from thescope of the invention as defined in the following claims.

1. A repairing method for an electrostatic chuck device in which atleast an adhesive layer and an attracting layer are provided on a metalbase, wherein a side surface of an eroded adhesive layer is wound with astring-like adhesive and thermal compression is performed thereafter. 2.The repairing method for an electrostatic chuck device of claim 1,wherein the string-like adhesive is made of a material same as amaterial of the adhesive layer.
 3. The repairing method for anelectrostatic chuck device of claim 1, wherein the adhesive layer andthe string-like adhesive contain acrylic rubber and thermosetting resin.4. The repairing method for an electrostatic chuck device of claim 1,wherein the string-like adhesive has a rectangular cross section.
 5. Therepairing method for an electrostatic chuck device of claim 1, wherein aheight of the string-like adhesive is about 1 to 2 times greater than aheight of the adhesive layer.
 6. The repairing method for anelectrostatic chuck device of claim 1, wherein the thermal compressionis performed under the condition of about 0.02 to 0.5 MPa.
 7. Arepairing apparatus for an electrostatic chuck device which is used inthe repairing method of claim 1, comprising a rotatable table forrotating the electrostatic chuck device and a bobbin for supplying theadhesive to the adhesive layer.
 8. The repairing apparatus for anelectrostatic chuck device of claim 7, further comprising a positioningdevice for positioning the adhesive between the bobbin and the adhesivelayer.
 9. An electrostatic chuck device in which at least an adhesivelayer and an attracting layer are provided on a metal base, wherein aside surface of the adhesive layer is wound with a string-like adhesive.